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KUKA AWSM 4800.2

 

The AWSM 4800.2 is a fully automatic wire guide saw machine for slicing ingots of silicon and other hard materials into wafers.

The design of the machine is especially adapted to slice big diameter wafers up to ø 450 mm used for production of integrated circuits for semiconductor industry.

 
KUKA AWSM 4800

Features and benefits

  • High performance at low operating costs
  • High quality of wafer surface without saw marks
  • Wire guide positioning by using a CCD Camera
  • Fully programmable control
  • Oil, glycol or water* based slurry
  • Direct measurement of tension
  • Low use of consumables
  • Remote diagnostics
  • Temperature stabilization of bearing heads
  • Loading and unloading device
  • Wire guide positioning +/- 0.1 μm
  • Custom-defined table feed rate and slurry flow profiles
  • Production capacity (example): Capacity is determined by the length and diameter of the ingot, desired thickness of wafers, diameter of wire, speed of plate motion (slicing speed) and preparatory time for starting of the machine.

- Ingot: ø 450 mm, 800 mm lengths
- Thickness of wafers: 950 μm
- Example result: 357 wafers per run
- Example result: P = 15 wafers per hour

 

Utility

  • Electric power: 3 + N + PE, 3 x 400 V / 230 V, 50 Hz, consumption 65 kVA
  • Compressed air: 0.6 MPa, maximum consumption 670 l/min
  • Cooling water: Closed cooling system - 50 kW (can be connected to external cooling system)
  • Dimensions: Approx. 4500 x 3500 x 2400 mm (width x heigth x depth)
  • Weight: Approx. 15 000 kg
 

Specifications

  • Ingot diameter (max.): 1 x ø 450 mm or 2 x ø 200 mm
  • Ingot length (max.): 2 x 800 mm up to ø 450 mm, 2 x 800 mm for 2 x 200 mm
  • Maximum wire speed: 14 m/sec
  • Table feed rate: 2 - 9999 μm/min
  • Wire tension: 15 - 43 N
  • Wire length: Up to 600 km
  • Wire diameter: 120 - 220 μm
 

 
 

 
 
 
 
 
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